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CAPABILITIES |
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| Layer Count: |
1 to 56 Layers |
| Material: |
XPC / FR1 / FR2 / CEM1 / CEM3 / FR4 / High Tg FR4 / Halogen Free Rogers / BT / PTFE / Ceramic-filled / Teflon / Polyimide / Nelco / Arlon / Taconic |
| Brd size: |
D/S: 1400mm x 610 mm
M/L: 1100mm x 610 mm |
| Max PCB thickness: |
10 mm (400 mils) |
| Min Board Thickness: |
12 mils |
| Core Thickness: |
3 mils |
| Copper (Max): |
6 ounces |
| Line Width / Space: |
3/3 mils |
| Layer to layer registration: |
+/-4 mils |
| Min Pitch: |
3 mils |
| Min Hole Size: |
8 mils |
| Hole Tolerance: |
+/-3 mils (PTH)
+/-2 mils (NPTH)
+/-2 mils (Positional Tolerance) |
| Technology: |
POFV / HDI / Backplane / Back Drilling / Buried Capacitor / Buried Resistor / Rigid-Flexible PCBs / Heatsinks / Silver Thru Hole / Metal Core PCB |
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